2021 Morgan Stanley Asia Internship Programs - Applications Open Now

Morgan Stanley Asia Offices are now offering a range of 2021 Summer Internship and Industrial Placement opportunities across different divisions to students graduating between October 2021 – July 2022. We would appreciate it if you can circulate the attached e-flyer to interested students to apply before the respective deadline.

 

Also, we will be welcoming students who graduate between June 2021 – July 2022 to apply for our Hong Kong Investment Banking Industrial Placement Program.

 

Thanks for your help in advance!

 

For any questions, please email us at asia.recruit@morganstanley.com